MEP Implementation Options

Facilitating rapid integration and high-volume cost reduction, MEP can be implemented in a variety of ways depending on the particular application. The four planned implementation options provide the needed flexibility and scalability to simplify integration while minimizing SWaP (size, weight, and power) and cost for high volume applications. MEP offers device manufacturers several key benefits:

  • Accommodates any mobile device
  • Meets a variety of high-accuracy PNT needs
  • Seamless, simple integration with flexible DSP and Fusion

MEP Implementation Form Factors

MEP Module

A drop-in solution intended for devices that do not currently have an RF or MEMs component structure. Suitable for lower-volume manufacturing.

MEP Module

 

MEP Core Processor

MEP core processor IC for medium-to-high volume manufacturing where adding a discrete chip is more acceptable to the design. IC provides core DSP and processing functions simplifying integration while maximizing performance
MEP Core Processor

 

MEP Embedded

Low-cost MEP software installed onto customer RFIC or DSP components within the device. Ideal for high-volume manufacturing, such as smart phones, where board real estate is limited and BOM/SWaP budgets are most sensitive to adding cost and parts.
MEP Embedded RFIC

 

MEP Lite

Basic, lowest cost solution. Downloadable using a device’s existing MEMs together with MEP fusion processor and Map Assist functions. Does not require additional hardware or low-level integration.
MEP Lite (Non RF)

MEP Module

Loctronix MEP Module is fully integrated with core processor and sensors in a separate drop-in module form-factor. The “drop-and-go” design easily integrates with simple I2C serial interface. C/C++ API is provided to further simplify communication with the module, thus eliminating most of the complexity for application developers. Complete SDK and module reference designs included. The MEP Module is ideal for low-volume and development applications, where integration simplicity is a highest priority.

MEP Core Processor

Our chip-based core-processor embeds all MEP functionality in a single, easy-to-integrate IC, enabling direct integration of MEP functionality in device hardware with support for a variety of sensors. MEP Core can be updated to support other devices (with some limitations, but generally all sensors are I2C interface). It is ideal for medium-volume applications providing flexibility for device manufacturers without significant integration complexity. Low-cost, low-power RF-front-end reference designs will be provided for GPS and standard cellular bands.

Embedded MEP

In the embedded implementation, all MEP functionality is provided in Verilog and C/C++ software for direct integration into Customer DSP / RFIC. The embedded solution targets highest-volume / lowest-cost applications, while providing the highest flexibility and adaptation capabilities.

MEP Lite

This non-RF-based solution provides a fusion engine without SCP support. It is ideal as a software download for supporting existing legacy devices. This solution requires map assist data to operate. MEP Lite is not as high performance as the full-bodied MEP platform but it provides an excellent stepping stone towards implementing the fully robust MEP solution in future devices.

For more information about MEP availability and technical specifications, please contact Tom.Davis@Loctronix.com.